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  4. PLASNET
PLASNET
    23/07/2018
    • Fair
    • The work done
    • Explanation
    IPACK - PACKAGING AND FOOD PROCESSING SYSTEMS FAIR
    octagonal profile stitches and 6mm chipboard.

    It is a functional and economical stand model that we offer to fairs and congress organizations with modular design, aluminum constructions, octagonal profile stitches and 6mm chipboard. The most common use is recognized as oktanorm or package stand.